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Signal Integrity

SI analysis enables the engineers to quickly and accurately analyze and eliminate SI and EMI/EMC problems and to ensure that signals can be successfully pass through PCBs. Recognizing the signal integrity problems early in the design cycle is influencing to the success of your new product. Our SI support is part of our PCB design flow provides an improving productivity, reducing development cycle and its cost and increasing the product rich performance.

The traces functioning at high speed where the SI analysis enabling and ensuring the data speed performing to our expected data transfer on the system. SI engineers are having rich knowledge in SI theory and expertise in simulation tools to analyze various SI issues like reflection due to impedance mismatch, crosstalk, and all losses in the high switching interconnects. We support both Pre and Post analysis as mentioned below

Simulation using IBIS Models
Eye Pattern & Attenuation plot for multi-Gigabit signals
Analysis of High Speed SERDES based designs
Multi-board system level simulation
Planning the stack-up for controlled impedance
Dielectric material selection for high frequency operation
Routing specifications (Trace width, spacing and length matching) and floor planning for critical components are Reflection, Ringing and Overshoot/Undershoot
Single ended and Differential Crosstalk Analysis
Channel Analysis for Serial Communication – Eye Diagram Analysis

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